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Bostik Unveils R3BOND® SYSTEM for Sustainable Flooring Renovations

Bostik has launched its R3BOND® SYSTEM, providing flooring fitters with a sustainable option for the installation, removal, and recycling of vinyl floorcoverings.

The R3BOND® SYSTEM is a removable bonding system which uses patented technology to revolutionise installations of vinyl floor coverings. Once removed, the system leaves behind a subfloor that requires very little preparation, meaning renovation times are significantly reduced. Carbon footprint is also lowered as, in most cases, there’s no need for primers and smoothing compounds to be used during subsequent renovations.

Comprised of a 75% bio-based adhesive and a unique grid, the patented solution enables vinyl floorcoverings to be removed without any adhesive residue, meaning they can be recycled at the end of life, instead of being sent to landfill.

Stephen Thornton, Technical Manager – Wall and Floor at Bostik, explains: “With our new R3BOND® SYSTEM, installers simply lay the grid on a Bostik smoothing compound and spread the adhesive on top, which is encapsulated, before applying the floorcovering.

“This simple process is enough to ensure that, when the floor needs refurbishing later down the line, the floorcoverings can be removed and recycled without adhesive contamination, and there is generally no need to prepare the existing smoothing compound before a new floor is laid.

“This provides floor fitters with a versatile solution that helps them achieve their sustainability goals while saving significant time and money on future renovations.”

The R3BOND® SYSTEM is designed for use with Bostik-approved smoothing compounds and offers high shear resistance with a short drying time of just 12 hours.

R3BOND® remains effective up to 50°C and is tested to withstand 150,000 cycles of castor chair movement, ensuring durability and reliability in the most demanding environments.

It is ideal for LVT, PVC, and other resilient tile and sheet floor coverings, including those with acoustic backings.

In addition, the system is compatible with warm water underfloor heating systems, provided the surface temperature does not exceed 27°C.

Learn more about the new Bostik R3BOND® SYSTEM: https://bostik-profloor.co.uk/r3bond/.

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